Master of Engineering in Microelectronics Manufacturing Engineering

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Overview

The microelectronics manufacturing engineering masters covers the intensive aspects of integrated circuit technology, modeling and simulation techniques, and hands-on laboratory verification of these processes. In the laboratory, students from various engineering and science backgrounds design and fabricate semiconductor circuits, learn how to utilize imaging equipment, develop and create systems, and manufacture and test their own integrated circuits in our cleanroom. Microelectronics manufacturing at RIT utilizes many different disciplines such as chemistry, physics, and engineering to provide a degree that makes our students very sought after in the job market.

The ME in microelectronics manufacturing engineering provides a broad-based education for students who are interested in a career in the semiconductor industry and hold a bachelor’s degree in traditional engineering or other science disciplines.

Program outcomes

After completing the program, students will be able to:

• Design and understand a sequence of processing steps to fabricate a solid-state device to meet a set of geometric, electrical, and/or processing parameters.
• Analyze experimental electrical data from a solid-state device to extract performance parameters for comparison to modeling parameters used in the device design.
• Understand current lithographic materials, processes, and systems to meet imaging and/or device patterning requirements.
• Understand the relevance of a process, or device, either proposed or existing, to current manufacturing practices.
• Perform in a microelectronic engineering environment, as evidenced by an internship.
• Appreciate the areas of specialty in the field of microelectronics, such as device engineering, circuit design, lithography, materials and processes, and yield and manufacturing.

Plan of study

Students are awarded the ME degree after the successful completion of 30 credit hours, which are comprised of core courses, elective courses, research seminars, and an internship. Under certain circumstances, a student may be required to complete bridge courses totaling more than the minimum number of credits. Students complete courses in microelectronics, microlithography, and manufacturing.

Microelectronics

The microelectronics courses cover major aspects of integrated circuit manufacturing technology, such as oxidation, diffusion, ion implantation, chemical vapor deposition, metallization, plasma etching, etc. These courses emphasize modeling and simulation techniques as well as hands-on laboratory verification of these processes. Students use special software tools for these processes. In the laboratory, students design and fabricate silicon MOS integrated circuits, learn how to utilize semiconductor processing equipment, develop and create a process, and manufacture and test their own integrated circuits.

Microlithography

The microlithography courses are advanced courses in chemistry, physics, and processing involved in microlithography. Optical lithography is studied through diffraction, Fourier, and image-assessment techniques. Scalar diffraction models are utilized to simulate aerial image formation and the influences of imaging parameters. Positive and negative resist systems, as well as processes for IC application, are studied. Advanced topics include chemically amplified resists; multiple-layer resist systems; phase-shift masks; an electron beam, X-ray, and deep UV lithography. Laboratory exercises include projection-system design, resist-materials characterization, process optimization, and electron-beam lithography.

Manufacturing

The manufacturing courses include topics such as scheduling, work-in-progress tracking, costing, inventory control, capital budgeting, productivity measures, and personnel management. Concepts of quality and statistical process control are introduced. The laboratory for this course is a student-run factory functioning within the department. Important issues such as measurement of yield, defect density, wafer mapping, control charts, and other manufacturing measurement tools are examined in lectures and through laboratory work. Computer-integrated manufacturing also is studied in detail. Process modeling, simulation, direct control, computer networking, database systems, linking application programs, facility monitoring, expert systems applications for diagnosis and training, and robotics are supported by laboratory experiences in the integrated circuit factory. The program is also offered online for engineers employed in the semiconductor industry.

Internship

The program requires students to complete an internship or take an additional elective course. The internship option involves a structured and supervised work experience that enables students to gain job-related skills that assist them in achieving their desired career goals.

An internship may be taken any time after the completion of the first semester and may be designed in a number of ways. At the conclusion of the internship, the submission of a final internship report to the faculty adviser and program director is required.

Industries

• Electronic and Computer Hardware
• Manufacturing
• Automotive
• Aerospace

Curriculum

Microelectronics manufacturing engineering, ME degree, typical course sequence

First Year

• MCEE-601 Microelectronic Fabrication
• MCEE-605 Lithography Materials and Processes
• MCEE-603 Thin Films
• MCEE-795 Microelectronics Research Methods
• MCEE-732 Microelectronics Manufacturing
• MCEE-602 VLS Process Modeling
• MCEE-615 Nanolithography Systems
• MCEE-795 Microelectronics Research Methods
• MCEE-777 Microelectronic Engineering Internship
• Graduate Electives

Admission Requirements

To be considered for admission to the ME program in microelectronic manufacturing engineering, candidates must fulfill the following requirements:

• Complete a graduate application.
• Hold a baccalaureate degree (or equivalent) from an accredited university or college in engineering or a related field.
• Submit official transcripts (in English) from all previously completed undergraduate and graduate course work.
• Have a minimum cumulative GPA of 3.0 (or equivalent).
• Submit two letters of recommendation from academic or professional sources.
• International applicants whose native language is not English must submit scores from the TOEFL, IELTS, or PTE. A minimum TOEFL score of 79 (internet-based) is required. A minimum IELTS score of 6.5 is required. The English language test score requirement is waived for native speakers of English or for those submitting transcripts from degrees earned at American institutions.
• Candidates applying with a bachelor’s degree in non-electrical or non-microelectronic engineering fields may be considered for admission, however, they may be required to complete additional bridge courses to ensure they are adequately prepared for graduate study.